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Proceedings Paper

Advanced EUV negative tone resist and underlayer approaches exhibiting sub-20nm half-pitch resolution
Author(s): Thomas Gädda; Nguyen Dang Luong; Markus Laukkanen; Kimmo Karaste; Oskari Kähkönen; Emilia Kauppi; Dimitrios Kazazis; Yasin Ekinci; Juha Rantala
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Paper Abstract

The RLS trade-off of EUV resists has been a major technical issue for high-volume manufacturing using EUVL. Significant attempts to develop of chemically-amplified resists, metal-containing resists, and a variety of other material classes have been made to obtain low LER at high resolution (R) and at a reasonable sensitivity (S). Previously, we have developed and reported work on silanol-containing polyhydrogensilsesquioxane resins and their use as negative tone resists. The developed silanol-containing polymer resists have demonstrated enhanced EUV sensitivity compared to traditional hydrogen silsesquioxane resins, and at the same time maintaining excellent etch properties. The resist may enable a bilayer stack technology in EUVL. Herein we report novel functionalized polyhydrogensilsesquioxane polymers and their use as negative tone resists. These materials exhibit improved LER/LWR and reasonably good EUV sensitivity. In best cases, data suggests no residues or bridging in the non-exposed areas. The optimized resist exhibits sub-20nm halfpitch resolution, low LER (2-3nm), and reasonable sensitivity (82.5 mJ/cm2). In addition, we also investigated the effect of three organic underlayers for EUV patterning and compared with the silicon substrate.

Paper Details

Date Published: 25 March 2019
PDF: 7 pages
Proc. SPIE 10960, Advances in Patterning Materials and Processes XXXVI, 109600B (25 March 2019); doi: 10.1117/12.2515600
Show Author Affiliations
Thomas Gädda, PiBond Oy (Finland)
Nguyen Dang Luong, PiBond Oy (Finland)
Markus Laukkanen, PiBond Oy (Finland)
Kimmo Karaste, PiBond Oy (Finland)
Oskari Kähkönen, PiBond Oy (Finland)
Emilia Kauppi, PiBond Oy (Finland)
Dimitrios Kazazis, Paul Scherrer Institut (Switzerland)
Yasin Ekinci, Paul Scherrer Institut (Switzerland)
Juha Rantala, PiBond Oy (Finland)

Published in SPIE Proceedings Vol. 10960:
Advances in Patterning Materials and Processes XXXVI
Roel Gronheid; Daniel P. Sanders, Editor(s)

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