Advanced technology nodes are demanding aggressive printability using EUV. EUV printing process inherently brings in stochastic defects. To measure and experience various types of Stochastics in EUV printing, high volume measurements are deemed necessary. Furthermore the classification of the defects in terms of stochastic and systematic is also required. The permutation and combinations of shapes, sizes, and proximity driven stochastics errors are high in numbers, leading to significant increase in the number of test structures needed. Without electrically measurable solutions, the defect test measurement exercise becomes impractical to perform visually. This paper will describe few examples of developing and handling the test structures capable to capture the defects and defect location and further to classify the defects in terms of stochastic or systematic defects.

Date Published: 4 June 2019
PDF: 11 pages
Proc. SPIE 10957, Extreme Ultraviolet (EUV) Lithography X, 109571M (4 June 2019); doi: 10.1117/12.2515418

Published in SPIE Proceedings Vol. 10957:
Extreme Ultraviolet (EUV) Lithography X
Kenneth A. Goldberg, Editor(s)