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Proceedings Paper

Piezoelectric wafer active sensors for sensing acoustic emission due to crack rubbing/clapping
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Paper Abstract

Crack rubbing or clapping in metallic structures generates acoustic emission (AE) signals. Such AE signals need to be distinguished from AE signal due to fatigue crack growth event. AE signal due to crack rubbing or clapping of fatigue generated crack was studied for a plate specimen. 20 mm fatigue crack was generated in a 1 mm thick aluminum plate specimen. Vibration-induced excitation was performed on the specimen to induce crack faying surface-motion for AE signal generation. Various specimen resonances have different crack faying surface motions, which were studied from FEM analysis. Modeshapes and crack faying surface motions of the specimen are studied at 35 Hz and 180 Hz specimen resonances. AE signals at various specimen resonances were recorded by piezoelectric wafer active sensors (PWAS) and the recorded waveforms are analyzed to obtain AE signatures. At various specimen resonances, AE signals have different signatures due to the change in crack faying surface motions. AE recording was done by using multiple PWAS sensors placed at various distances from the crack. The difference in AE signals close to crack and distant from crack as well as the geometric spreading of AE signals originating due to crack rubbing was studied from multi-sensor experiments.

Paper Details

Date Published: 21 March 2019
PDF: 11 pages
Proc. SPIE 10967, Active and Passive Smart Structures and Integrated Systems XIII, 109672A (21 March 2019); doi: 10.1117/12.2515314
Show Author Affiliations
Roshan Joseph, Univ. of South Carolina (United States)
Md Yeasin Bhuiyan, Univ. of South Carolina (United States)
Victor Giurgiutiu, Univ. of South Carolina (United States)


Published in SPIE Proceedings Vol. 10967:
Active and Passive Smart Structures and Integrated Systems XIII
Alper Erturk, Editor(s)

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