Share Email Print
cover

Proceedings Paper

Multiple beam inspection (MBI) for 7nm node and beyond: technologies and applications
Author(s): Eric Ma; Kevin Chou; Martin Ebert; Xuedong Liu; Weiming Ren; Xuerang Hu; Martijn Maassen; Weihua Yin; Aiden Chen; Fei Wang; Oliver D. Patterson
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

EUV lithography has been adopted in most advanced semiconductor manufacture fabs, enabling the next step in design rule scaling. With this progress, minimum critical defect size has become smaller and harder to detect. Defect inspection equipment suppliers must therefore in parallel provide a significant step up in inspection sensitivity at a reasonable throughput. Optical inspection tools are facing an unprecedented challenge because defects less than 10nm are not optically visible. As an alternative, semiconductor manufacturers have turned toward e-beam inspection. E-beam inspection is widely used in R&D to shorten development cycle-time and selectively used in high volume manufacturing (HVM) for process monitoring, however currently it is not fast enough for large-scale replacement of optical inspection. Our approach to address this shortcoming is to combine cutting edge multiple-beam technology with a cutting edge positioning system/computation architecture to create a next generation e-beam inspection system capable of scanning with multiple electron beams at the same time. This paper reports on the progress in developing such a system as well as future multi-beam inspection applications.

Paper Details

Date Published: 26 March 2019
PDF: 9 pages
Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 109591R (26 March 2019); doi: 10.1117/12.2515272
Show Author Affiliations
Eric Ma, Hermes-Microvision Inc. (United States)
Kevin Chou, Hermes-Microvision Inc. (United States)
Martin Ebert, Hermes-Microvision Inc. (United States)
Xuedong Liu, Hermes-Microvision Inc. (United States)
Weiming Ren, Hermes-Microvision Inc. (United States)
Xuerang Hu, Hermes-Microvision Inc. (United States)
Martijn Maassen, Hermes-Microvision Inc. (United States)
Weihua Yin, Hermes-Microvision Inc. (United States)
Aiden Chen, Hermes-Microvision Inc. (United States)
Fei Wang, Hermes-Microvision Inc. (United States)
Oliver D. Patterson, Hermes-Microvision Inc. (United States)


Published in SPIE Proceedings Vol. 10959:
Metrology, Inspection, and Process Control for Microlithography XXXIII
Vladimir A. Ukraintsev; Ofer Adan, Editor(s)

© SPIE. Terms of Use
Back to Top
PREMIUM CONTENT
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?
close_icon_gray