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Proceedings Paper

Machine learning and hybrid metrology using scatterometry and LE-XRF to detect voids in copper lines
Author(s): Dexin Kong; Koichi Motoyama; Abraham Arceo de la peña; Huai Huang; Brock Mendoza; Mary Breton; Gangadhara Raja Muthinti; Hosadurga Shobha; Liying Jiang; Juntao Li; James J. Demarest; John Gaudiello; Gauri Karve; Aron Cepler; Matthew Sendelbach; Susan Emans; Paul Isbester; Kavita Shah; Shay Wolfing; Avron Ger
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Paper Abstract

Voids in copper lines are a common failure mechanism in the back end of line (BEOL) of integrated circuits manufacturing, affecting chip yield and reliability. As subsequent process nodes continue to shrink metal line dimensions, monitoring and control of these voids gain more and more importance [1]. Currently, there is no quantitative in-line metrology technique that allows voids to be identified and measured. This work aims to develop a new method to do so, by combining scatterometry (also referred to as Optical Critical Dimension or Optical CD) and low-energy x-ray fluorescence (LE-XRF), as well as machine learning techniques. By combining the inputs from these tools in the form of hybrid metrology, as well as with the incorporation of machine learning methods, we create a new metric, referred to as Vxo, to characterize the quantity of void. Additionally, the results are compared with inline electrical test data, as higher amounts of voids were expected to increase the measured resistivity. This was not found to be the case, as the impact of the voids was much less of a factor than variation in the cross-sectional area of the lines.

Paper Details

Date Published: 2 July 2019
PDF: 14 pages
Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 109590A (2 July 2019); doi: 10.1117/12.2515257
Show Author Affiliations
Dexin Kong, IBM Corp. (United States)
Koichi Motoyama, IBM Corp. (United States)
Abraham Arceo de la peña, IBM Corp (United States)
Huai Huang, IBM Corp. (United States)
Brock Mendoza, IBM Corp. (United States)
Mary Breton, IBM Corp. (United States)
Gangadhara Raja Muthinti, IBM Corp. (United States)
Hosadurga Shobha, IBM Corp. (United States)
Liying Jiang, IBM Corp. (United States)
Juntao Li, IBM Corp. (United States)
James J. Demarest, IBM Corp. (United States)
John Gaudiello, IBM Corp. (United States)
Gauri Karve, IBM Corp. (United States)
Aron Cepler, Nova Measuring Instruments Inc. (United States)
Matthew Sendelbach, Nova Measuring Instruments Inc. (United States)
Susan Emans, Nova Measuring Instruments Inc. (United States)
Paul Isbester, Nova Measuring Instruments, Inc. (United States)
Kavita Shah, Nova Measuring Instruments Inc. (United States)
Shay Wolfing, Nova Measuring Instruments Ltd. (Israel)
Avron Ger, Nova Measuring Instruments Ltd. (Israel)


Published in SPIE Proceedings Vol. 10959:
Metrology, Inspection, and Process Control for Microlithography XXXIII
Vladimir A. Ukraintsev; Ofer Adan, Editor(s)

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