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Proceedings Paper

Development of novel thick spin-on carbon hardmask
Author(s): Byeri Yoon; Seungwook Shin; Youngmin Kim; Yumi Heo; Soyeon Park; Sungho Choi; Miyeon Han; Sanghak Lim
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Paper Abstract

As the semiconductor manufacturing industry develops into the cutting-edge technology, the thick and high etch resistant material is required. Amorphous carbon layer (ACL), currently widely-used deposition-type film, can meet the requirement for etch resistance, but it has intrinsic problems such as darkness, defect control difficulty and low throughput which give limits to its further application. In order to overcome these problems, a novel thick spin-on carbon hardmask (SOH) is introduced in this paper. We designed the material from molecular level to achieve high etch resistance, good optical property, long shelf life and high thickness. Up to 3 micron-thick films with high transparency and etch resistance were successfully fabricated by spin-coating process. With long-enough shelf life for usage, we expect that this novel SOH can expand the possibility of spin-on material.

Paper Details

Date Published: 25 March 2019
PDF: 6 pages
Proc. SPIE 10960, Advances in Patterning Materials and Processes XXXVI, 109601D (25 March 2019); doi: 10.1117/12.2515136
Show Author Affiliations
Byeri Yoon, Samsung SDI (Korea, Republic of)
Seungwook Shin, Samsung SDI (Korea, Republic of)
Youngmin Kim, Samsung SDI (Korea, Republic of)
Yumi Heo, Samsung SDI (Korea, Republic of)
Soyeon Park, Samsung SDI (Korea, Republic of)
Sungho Choi, Samsung SDI (Korea, Republic of)
Miyeon Han, Samsung SDI (Korea, Republic of)
Sanghak Lim, Samsung SDI (Korea, Republic of)

Published in SPIE Proceedings Vol. 10960:
Advances in Patterning Materials and Processes XXXVI
Roel Gronheid; Daniel P. Sanders, Editor(s)

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