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Proceedings Paper

Ultra-thin conformal coating for spin-on doping applications
Author(s): Mingqi Li; Bhooshan Popere; Peter Trefonas; Andrew T. Heitsch; Ratchana Limary; Reika Katsumata; Yuanyi Zhang; Rachel A. Segalman
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Paper Abstract

As devices become ever smaller and more sophisticated, there is also a general need for creating high quality defect-free thin coatings of polymers on 3-dimensional wafer topography, for example, for shrinkage of the size of trench openings. To address this challenge, we developed a spin-on polymer brush material, which comprises of a dopant moiety with a universal adhesive dopamine end group. We demonstrate that the polymer coating is highly conformal and free of pinhole defects, even when only a few nm thick, or when coated over high aspect ratio over 200 nm deep trench topography. Our investigations demonstrate that the dopamine end group enables stable sub-10 nm thick conformal coatings on three-dimensional surfaces.

Furthermore, on acute 3-dimensional semiconductor topography, the creation of highly doped abrupt, ultra-shallow junctions with three-dimensional control are essential for successful source-drain contacts. In consideration of this need, we extended the above polymer brush concept further by incorporating a suitable implant dopant atom, such as boron, into the monomer structure. After conformal coating and a subsequent rapid thermal annealing process, the dopant atom is driven into the semiconductor substrate underneath the polymer film. This is potentially very useful for uniform all-around doping of 3-dimensional topography such as FinFETs or Nanowire-FETs. A high dopant dosage on silicon substrate with appropriate shallow implant characteristics was demonstrated for the end-functionalized dopant polymer brush, highlighting one of the promising applications of such conformal coatings.

Paper Details

Date Published: 25 March 2019
PDF: 12 pages
Proc. SPIE 10960, Advances in Patterning Materials and Processes XXXVI, 109600R (25 March 2019); doi: 10.1117/12.2514830
Show Author Affiliations
Mingqi Li, DowDupont Electronics and Imaging (United States)
Bhooshan Popere, DowDupont Electronics and Imaging (United States)
Peter Trefonas, DowDupont Electronics and Imaging (United States)
Andrew T. Heitsch, Dow Chemical Co. (United States)
Ratchana Limary, Lam Research Corp. (United States)
Reika Katsumata, Univ. of California, Santa Barbara (United States)
Yuanyi Zhang, Univ. of California, Santa Barbara (United States)
Rachel A. Segalman, Univ. of California, Santa Barbara (United States)

Published in SPIE Proceedings Vol. 10960:
Advances in Patterning Materials and Processes XXXVI
Roel Gronheid; Daniel P. Sanders, Editor(s)

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