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Proceedings Paper

Optical characterization of multi-NST nanowire test structures using Mueller matrix spectroscopic ellipsometry (MMSE) based scatterometry for sub 5nm nodes
Author(s): Madhulika Korde; Subhadeep Kal; Cheryl Pereira; Nick Keller; Aelan Mosden; Alain C. Diebold
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Paper Abstract

With the rapid advancement of the CMOS technology in the semiconductor industry, innovative device fabrication techniques have led to the development of Nanosheet (NS) FETs and Nanowire (NW) FETs with sub nm dimensions. The application of Mueller Matrix Spectroscopic Ellipsometry (MMSE) based scatterometry simulations to characterize these complex 3D structures is described. Optical model-based simulations were used to investigate sensitivity and limitations of MMSE to characterize small changes in the etching of these NWTS structures. Cross-sectional Scanning Electron Microscopy and Tunneling Electron Microscopy provided a reference technique for the scatterometry simulations. Additionally, sensitivity to the nanowire test structure shape, size of holes, nanosheet thicknesses of each layer and the rounding at the top of the structure were investigated. As a result of this study, we find that Mueller Matrix scatterometry has the sensitivity to monitor dimensional changes during the progression of the selective SiGe etch for the sub surface nanowires and thus provide a reliable measurement method for process control.

Paper Details

Date Published: 26 March 2019
PDF: 12 pages
Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 109590X (26 March 2019); doi: 10.1117/12.2514748
Show Author Affiliations
Madhulika Korde, SUNY Polytechnic Institute (United States)
Subhadeep Kal, TEL Technology Ctr., America, LLC (United States)
Cheryl Pereira, TEL Technology Ctr., America, LLC (United States)
Nick Keller, Nanometrics Inc. (United States)
Aelan Mosden, TEL Technology Ctr., America, LLC (United States)
Alain C. Diebold, SUNY Polytechnic Institute (United States)


Published in SPIE Proceedings Vol. 10959:
Metrology, Inspection, and Process Control for Microlithography XXXIII
Vladimir A. Ukraintsev; Ofer Adan, Editor(s)

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