
Proceedings Paper
Acoustic emission characterization of PVC pipe for various joining typesFormat | Member Price | Non-Member Price |
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Paper Abstract
Acoustic emission characteristics according to variety methods for joining PVC pipe during tensile test were investigated. AE amplitudes, the number of AE hits and AE energy were compared through the nonparametric statistics of MannWhitney method. 25A PVC-C pipe and four types of joining were used in this study: only insert, welding, bonding and bonding with welding. The average of the number of AE hits for bonding specimen was 416.2 and for bonding with welding specimen was 522.2. However the result of Mann-Whitney nonparametric static indicated there is no difference (p=0.2963). The average of cumulative AE energy for bonding specimen was 47.8 × 103 and for bonding with welding specimen was 662.5 × 103. Therefore the result of Mann-Whitney nonparametric static indicated there is significant difference (p=0.0122). In this study, the analysis of AE signal characteristics confirmed that the tensile damage behavior varies depending on the bonding method of PVC pipe and socket.
Paper Details
Date Published: 1 April 2019
PDF: 6 pages
Proc. SPIE 10971, Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XIII, 109711W (1 April 2019); doi: 10.1117/12.2512133
Published in SPIE Proceedings Vol. 10971:
Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XIII
Andrew L. Gyekenyesi, Editor(s)
PDF: 6 pages
Proc. SPIE 10971, Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XIII, 109711W (1 April 2019); doi: 10.1117/12.2512133
Show Author Affiliations
Ja-Uk Gu, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Su-Hyoung Cho, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Su-Hyoung Cho, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jong-Sun Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Baek-Min Seong, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Baek-Min Seong, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Published in SPIE Proceedings Vol. 10971:
Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XIII
Andrew L. Gyekenyesi, Editor(s)
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