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Proceedings Paper

Silicon-micromachined poppet valve with an octagonal diaphragm
Author(s): James W Siekkinen; K. J. Haltiner; Dan W. Chilcott; L. X. Huang; Steve E. Staller
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Paper Abstract

A new pressure-activated silicon micromachined poppet valve design and fabrication process are presented for automotive fuel applications. Although non-electrically activated, micromachining provides a physical structure which is difficult or expensive to achieve with conventional method machined parts. Bulk etching is used to fabricate an octagonal silicon diaphragm which moves in response to the inlet fluid pressure. Silicon direct bonding is used to combine two layers, one with an inlet flow chamber and valve boss, and a second with a movable diaphragm and valve seat. The outlet side of the diaphragm includes a spring locator to position a counter-force mechanical spring. The diaphragm's burst pressure is reduced and varies greatly depending on the alignment of the clamping edges above and below the diaphragm.

Paper Details

Date Published: 23 September 1996
PDF: 9 pages
Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); doi: 10.1117/12.251209
Show Author Affiliations
James W Siekkinen, Delco Electronics Corp. (United States)
K. J. Haltiner, Delphi Automotive Systems (United States)
Dan W. Chilcott, Delco Electronics Corp. (United States)
L. X. Huang, Delco Electronics Corp. (United States)
Steve E. Staller, Delco Electronics Corp. (United States)

Published in SPIE Proceedings Vol. 2879:
Micromachining and Microfabrication Process Technology II
Stella W. Pang; Shih-Chia Chang, Editor(s)

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