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Proceedings Paper

Development of high power annular diode laser array using hard solder
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Paper Abstract

High power QCW diode laser stacks have been widely used in pumping applications for years. Different package structures of diode laser stacks are applied for pumping the cylindrical rod crystal, such as modular G-Stack, horizontal, vertical and annular arrays. Annular array is preferred in pumping of QCW mode with low duty cycle and short pulse width, due to the advantage of compact structural size, uniform light beam distribution and convenient electric connection. However, the development of annular diode laser array using hard solder is difficult because of the complex bonding process of diode laser on annular heatsink with conventional bonding fixture. Furthermore the stress and thermal behavior is yet to be well studied on the annular diode laser array. In this work, a sophisticated annular diode laser array was developed using hard solder. Optimized structure and thermal design were conducted to achieve uniform light beam distribution and good heat dissipation. Stress release structure of diode laser stack is applied to reduce the risk of chip crack and deviation of spatial spectrum. The annular diode laser array consists of 44 bars in a ring, with the peak output power of each bar over 500W. The maximum output power of each bar reaches 673 W.

Paper Details

Date Published: 4 March 2019
PDF: 14 pages
Proc. SPIE 10899, Components and Packaging for Laser Systems V, 108990A (4 March 2019); doi: 10.1117/12.2510023
Show Author Affiliations
Dong Hou, Focuslight Technologies, Inc. (China)
Lichen Sun, Focuslight Technologies, Inc. (China)
Tuanwei Fu, Focuslight Technologies, Inc. (China)
Li Chen, Focuslight Technologies, Inc. (China)
Xuejie Liang, Focuslight Technologies, Inc. (China)
Lei Cai, Focuslight Technologies, Inc. (China)
Yan Yang, Focuslight Technologies, Inc. (China)
Jingwei Wang, Focuslight Technologies, Inc. (China)
Minna Yan, Focuslight Technologies, Inc. (China)
Chungen Zah, Focuslight Technologies, Inc. (China)
Xingsheng Liu, Focuslight Technologies, Inc. (China)
Xi'an Institute of Optics and Precision Mechanics (China)

Published in SPIE Proceedings Vol. 10899:
Components and Packaging for Laser Systems V
Alexei L. Glebov; Paul O. Leisher, Editor(s)

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