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Proceedings Paper

Erbium-doped polymer waveguide amplifiers for PCB-integrated optical links
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Paper Abstract

Optical technologies are increasingly considered for use in high-performance electronic systems to overcome the performance bottleneck of electrical interconnects when operating at high frequencies and provide high-speed communication between electronic chips and modules. Polymer waveguides are leading candidates for implementing board-level optical interconnections as they exhibit favourable mechanical, thermal and optical properties for direct integration onto conventional printed circuit boards (PCBs). Numerous system demonstrators have been reported in recent years featuring different types of polymer materials and opto-electronic (OE) PCB designs. However, all demonstrated polymer-based interconnection technologies are currently passive, which limits the length of the on-board links and the number of components that can be connected in optical bus architectures. In this paper therefore, we present work towards the formation of low-cost optical waveguide amplifiers that can be readily integrated onto standard PCBs by combining two promising optical technologies: siloxane-based polymers and ultra-fast laser plasma implantation (ULPI). Siloxane-based waveguides exhibit high-temperature resistance in excess of 300°C and low loss at different wavelength ranges, while ULPI has been demonstrated to produce very high dopant concentrations in glass thin films with values of 1.63×1021 cm−3 recently reported in Er-doped silica layers. Here we present detailed simulation studies that demonstrate the potential to achieve a internal gain of up to 8 dB/cm from such structures and report on initial experimental work on Er-doped films and waveguides demonstrating photoluminescence and good lifetimes.

Paper Details

Date Published: 4 March 2019
PDF: 10 pages
Proc. SPIE 10924, Optical Interconnects XIX, 1092403 (4 March 2019); doi: 10.1117/12.2509983
Show Author Affiliations
Marcin Ziarko, Univ. of Cambridge (United Kingdom)
Nikos Bamiedakis, Univ. of Cambridge (United Kingdom)
Eric Kumi-Barimah, Univ. of Leeds (United Kingdom)
Gin Jose, Univ. of Leeds (United Kingdom)
Richard V. Penty, Univ. of Cambridge (United Kingdom)
Ian H. White, Univ. of Cambridge (United Kingdom)

Published in SPIE Proceedings Vol. 10924:
Optical Interconnects XIX
Henning Schröder; Ray T. Chen, Editor(s)

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