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Proceedings Paper

Mechanical characterization of shape memory micromaterials
Author(s): Manfred Kohl; K. D. Skrobanek; C. M. Goh; David M. Allen
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Paper Abstract

A characterization method based on beam-bending experiments and finite element simulations has been developed. Calibrated microweights are applied to double-beam test devices with typical beam widths of 100 micrometers and lengths of 2 mm to determine load-dependent displacements with a maximum resolution of about 2 (mu) N and 2 micrometers , respectively. The resulting characteristics are used to determine the corresponding stress-strain characteristics, transformation temperatures and stress-rates of the material. The method has been used to study test devices of TiNi thin sheets with thicknesses d between 160 and 20 micrometers and of sputtered thin films (d equals 8 micrometers ) microfabricated by laser cutting or electrolytic photoetching. The measurements did not show any influence of the microfabrication processes. An investigation of size effects in test devices with decreasing thicknesses revealed enhanced transformation hystereses for thicknesses in the order of the grain size.

Paper Details

Date Published: 13 September 1996
PDF: 11 pages
Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); doi: 10.1117/12.250972
Show Author Affiliations
Manfred Kohl, Forschungszentrum Karlsruhe GmbH (Germany)
K. D. Skrobanek, Forschungszentrum Karlsruhe GmbH (Germany)
C. M. Goh, Cranfield Univ. (United Kingdom)
David M. Allen, Cranfield Univ. (United Kingdom)

Published in SPIE Proceedings Vol. 2880:
Microlithography and Metrology in Micromachining II
Michael T. Postek Jr.; Craig R. Friedrich, Editor(s)

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