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Proceedings Paper

Multiexposure capability development for deep x-ray lithography for MEMS
Author(s): Chantal G. Khan Malek; Robert L. Wood; Bruce W. Dudley; Zhong Geng Ling; Volker Saile
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Paper Abstract

The X-ray lithography and micromachining facility at CAMD hosts the `print-shop' for the development and prototype exposures in LIGA-like processing techniques for the HI-MEMS Alliance. A simple fixture with alignment, tilt, and rotation modules has been developed. It allows for multiple level exposures with registration. More complex shapes can be achieved by rotating and tilting the mask/wafer assembly with respect to the incident X-ray beam. The alignment system is based on optical registration using an X-ray mask with targets on optically transparent windows. The masks were fabricated at MCNC. The alignment tests and off-axis exposures were performed at CAMD. Overlay accuracy of +/- 5 micrometers has been demonstrated.

Paper Details

Date Published: 13 September 1996
PDF: 11 pages
Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); doi: 10.1117/12.250947
Show Author Affiliations
Chantal G. Khan Malek, Louisiana State Univ. (United States)
Robert L. Wood, Microelectronics Ctr. of North Carolina (United States)
Bruce W. Dudley, Microelectronics Ctr. of North Carolina (United States)
Zhong Geng Ling, Microelectronics Ctr. of North Carolina (United States)
Volker Saile, Louisiana State Univ. (United States)

Published in SPIE Proceedings Vol. 2880:
Microlithography and Metrology in Micromachining II
Michael T. Postek Jr.; Craig R. Friedrich, Editor(s)

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