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Proceedings Paper

Critical dimension metrology for MEMS processes using electrical techniques
Author(s): Richard A. Allen; Janet C. Marshall
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Paper Abstract

Electrical critical dimension (ECD) test structures have been adapted for use in a surface micromachining environment and fabricated along side various MicroElectroMechanical Systems (MEMS) structures. These freestanding ECD test structures, which are exposed to air on all surfaces (that is, no encompassing oxide), provide the ability to measure two key metrological process parameters, sheet resistance and feature width, that can affect the threshold at which released fixed-fixed beam MEMS structures experience deflection due to residual compressive strain.

Paper Details

Date Published: 13 September 1996
PDF: 7 pages
Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); doi: 10.1117/12.250946
Show Author Affiliations
Richard A. Allen, National Institute of Standards and Technology (United States)
Janet C. Marshall, National Institute of Standards and Technology (United States)

Published in SPIE Proceedings Vol. 2880:
Microlithography and Metrology in Micromachining II
Michael T. Postek Jr.; Craig R. Friedrich, Editor(s)

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