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Proceedings Paper

Automated collection of yield and performance analysis data during UltraSPARC-I microprocessor production test
Author(s): Matt Koeppen; John Moore
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Paper Abstract

The UltraSPARC-I microprocessor is tested at several stages in the manufacturing flow to screen out any chips which contain manufacturing defects and to sort chips by speed. Custom test hardware and software have been developed to perform production test of UltraSPARC-I in both wafer and packaged form. To speed up chip yield and performance improvement, we collect detailed yield and performance measurement data during test of every microprocessor manufactured. The data collected includes detailed pass or fail results of individual patterns, performance measurements of maximum operating frequency and Vcc, parametric measurements of transistor saturation currents and ring oscillator frequencies, and Idd measurements. The goal of our data collection is to provide, without the need for engineering retest, immediate diagnostic information on why each chip yielded and performed as it did, enabling yield and performance issues to be quickly identified and subsequently resolved.

Paper Details

Date Published: 12 September 1996
PDF: 10 pages
Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); doi: 10.1117/12.250840
Show Author Affiliations
Matt Koeppen, Texas Instruments Inc. (United States)
John Moore, Texas Instruments Inc. (United States)

Published in SPIE Proceedings Vol. 2874:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II
Ali Keshavarzi; Sharad Prasad; Hans-Dieter Hartmann, Editor(s)

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