Share Email Print

Proceedings Paper

Role of RIE in microchip bond pad corrosion
Author(s): Rickey Brownson; Kevin Butler; Sally Cadena; Mark Detar; Ivan Johnson; Lonnie McCoulloch; Jim McCoulloch; Brajendra Mishra; Jerry T. Healey; Karen Honcik; Tony T. Phan; Todd Sterif; H. Stevens; Anita Tovar
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The discoloration of microchip bond pads due to the corrosive effects of the chemistries they are exposed to, poses a special problem for subsequent wire bonding operations. Such corrosion constitutes not only a cosmetic defect, but also interferes with the adhesion of the gold ball bonds to the bonding pads and compromises electrical connections to the device. These defects pose a serious reliability problem, and precautions must be taken in the manufacture of microelectronic devices to ensure that bond pad corrosion does not occur. This paper describes the phenomenon of bond pad staining/corrosion as well as the factors which influence its occurrence. A series of experiments were conducted to isolate and understand the corrosion mechanism, and the results of these experiments are presented. Finally, two different process modifications are presented which eliminate the occurrence of bond pad corrosion: a double sintering process, and the elimination of rf sputter etch prior to TiN ARC deposition on top layer metal.

Paper Details

Date Published: 12 September 1996
PDF: 8 pages
Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); doi: 10.1117/12.250819
Show Author Affiliations
Rickey Brownson, Motorola (United States)
Kevin Butler, Motorola (United States)
Sally Cadena, Motorola (United States)
Mark Detar, Motorola (United States)
Ivan Johnson, Motorola (United States)
Lonnie McCoulloch, Motorola (United States)
Jim McCoulloch, Motorola (United States)
Brajendra Mishra, Motorola (United States)
Jerry T. Healey, Motorola (United States)
Karen Honcik, Motorola (United States)
Tony T. Phan, Motorola (United States)
Todd Sterif, Motorola (United States)
H. Stevens, Motorola (United States)
Anita Tovar, Motorola (United States)

Published in SPIE Proceedings Vol. 2874:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II
Ali Keshavarzi; Sharad Prasad; Hans-Dieter Hartmann, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?