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Proceedings Paper

Large-scale industrial application for excimer lasers: via-hole-drilling by photoablation
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Paper Abstract

Numerous potential excimer laser processing applications have recently been reported in the literature but examples of large scale excimer laser use in an industrial environment are very rare. In this article we inform about the different techniques and also about one of the first processes in which excimer lasers are used in a production line: Via-holes with aspect ratios close to one used in a printed circuit board of a high density multi-chip module are generated by ablation of the dielectric layer in an extremely reliable and reproducible way. The important processing parameters will be discussed.

Paper Details

Date Published: 1 March 1991
PDF: 12 pages
Proc. SPIE 1377, Excimer Laser Materials Processing and Beam Delivery Systems, (1 March 1991); doi: 10.1117/12.25035
Show Author Affiliations
Friedrich G. Bachmann, Siemens AG (Germany)

Published in SPIE Proceedings Vol. 1377:
Excimer Laser Materials Processing and Beam Delivery Systems
Bernhard P. Piwczyk, Editor(s)

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