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Proceedings Paper

Large-scale high-resolution 3D laser scanner for solder-paste inspection
Author(s): Jef L. Horijon; Fred C. M. Couweleers; Willem D. van Amstel
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Paper Abstract

An industrial 3D laser scanner is presented for measurement of solder paste screening quality in an automated PCB assembly line. The scanner provides telecentric illumination and imaging in a 305 mm (12') long scan line at a maximum rate of more than 1000 scans per second. Synchronized height measurement is performed using a double triangulation scheme at large angles and wide aperture. Pixel sizes range down to 18 micrometers , yielding more than 16,000 pixels in a scan line. Depth resolution is 10 micrometers over a 2.5 mm measuring range. Some practical details on scanner assembly will be discussed. Combined with accurate, fast processing and control electronics this 3D sensor enables 100% inspection at high production speeds.

Paper Details

Date Published: 23 August 1996
PDF: 9 pages
Proc. SPIE 2774, Design and Engineering of Optical Systems, (23 August 1996); doi: 10.1117/12.246699
Show Author Affiliations
Jef L. Horijon, Philips Ctr. for Manufacturing Technology (Netherlands)
Fred C. M. Couweleers, Philips Industrial Electronics Div. (Netherlands)
Willem D. van Amstel, Philips Ctr. for Manufacturing Technology (Netherlands)

Published in SPIE Proceedings Vol. 2774:
Design and Engineering of Optical Systems
Joseph J. M. Braat, Editor(s)

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