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Proceedings Paper

Interferometric analysis of strained thin silicon films
Author(s): Bertrand Trolard; Gilbert M. Tribillon; Eric Bonnotte; Patrick Delobelle; Luc Bornier
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Paper Abstract

With the aim to characterize mechanical properties of thin films, a widely micromechanic test, bulging, is associated with two contactless and noninvasive optical methods, holographic interferometry and projected fringes. These two complementary processes are combined with phase measurement interferometry to get out-of-plane displacements. These solutions are discussed in terms of accuracy and sensitivity. An application is presented on single crystal silicon. Experimental values are compared to results obtained with finite element modeling. Considering the same principle, measurement shapes are performed on multi-layer membranes to analyze residual stresses.

Paper Details

Date Published: 19 July 1996
PDF: 12 pages
Proc. SPIE 2861, Laser Interferometry VIII: Applications, (19 July 1996); doi: 10.1117/12.245165
Show Author Affiliations
Bertrand Trolard, Worcester Polytechnic Institute and Univ. de Franche-Compte (United States)
Gilbert M. Tribillon, Univ. de Franche-Comte (France)
Eric Bonnotte, Univ. de Franche-Comte (Japan)
Patrick Delobelle, Univ. de Franche-Comte (France)
Luc Bornier, Univ. de Franche-Comte (France)

Published in SPIE Proceedings Vol. 2861:
Laser Interferometry VIII: Applications
Ryszard J. Pryputniewicz; Gordon M. Brown; Werner P. O. Jueptner, Editor(s)

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