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Proceedings Paper

Near-room-temperature performance of an SWIR InGaAs/Si hybrid 96 elementx25 TDI high-performance FPA
Author(s): Richard C. McKee; Donald Lampe; James Halvis; Timothy F. Henricks; Thomas E. Wilson; William E. Kleinhans; Krishna Rao Linga; Michael J. Lange
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Paper Abstract

Performance of a SWIR FPA targeting LANDSAT S/N levels in the near room temperature (> 220 K) is presented. The FPA consists of a 96 X 25 element InGaAs array with 48 (mu) X 48 (mu) photo-voltaic pixels bump-bonded to a Si multiplexer. Cutoff wavelength of an array is tailored from 1.68 (mu) to 2.4 (mu) . The longer cutoff is required for Band 7. The multiplexer design incorporates a CMOS CCD process and is a 96 channel X 25 TDI scanning array with pixel pitch of 48 (mu) cross track by 96 (mu) intrack. Each unit cell uses a Capacitive Trans-Impedance Amplifier) with Correlated Double Sampling. Other notable chip features include electrically selectable TDI modes (0, 1, 8, 16, and 25), forward and reverse scan, and 1 X 1 and 2 X 2 aggregation modes. Timing and biases are self generated by the multiplexer.

Paper Details

Date Published: 17 June 1996
PDF: 10 pages
Proc. SPIE 2746, Infrared Detectors and Focal Plane Arrays IV, (17 June 1996); doi: 10.1117/12.243036
Show Author Affiliations
Richard C. McKee, Northrop Grumman Corp. (United States)
Donald Lampe, Northrop Grumman Corp. (United States)
James Halvis, Northrop Grumman Corp. (United States)
Timothy F. Henricks, Cadence Design Systems, Inc. (United States)
Thomas E. Wilson, Cadence Design Systems, Inc. (United States)
William E. Kleinhans, Valley Oaks Semiconductor, Inc. (United States)
Krishna Rao Linga, EPITAXX, Inc. (United States)
Michael J. Lange, Sensors Unlimited, Inc. (United States)

Published in SPIE Proceedings Vol. 2746:
Infrared Detectors and Focal Plane Arrays IV
Eustace L. Dereniak; Robert E. Sampson, Editor(s)

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