Share Email Print

Proceedings Paper

Mark topography for alignment and registration in projection electron lithography
Author(s): Reginald C. Farrow; Masis M. Mkrtchyan; Kevin Bolen; Myrtle I. Blakey; Christopher J. Biddick; Linus A. Fetter; Harold A. Huggins; Regine G. Tarascon-Auriol; Steven D. Berger
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We have studied two mark geometries for possible use in a projection e-beam lithography system using SCALPEL (scattering with angular limitation in projection electron lithography). These are V-grooves and vertically etched geometries, pedestals or trenches. We report results of measurements of backscattered electron (BSE) contrast form topographic marks of varying size and as a function of energy up to 100 kV. The marks were fabricated on silicon wafers. The measurements were taken both in a scanning electron microscope and in an experimental SCALPEL machine operating in focused probe mode. The V-grooves ranged from 1.0 to 30 micrometers wide. The vertical etched features ranged from 2 to 30 micrometers wide and 0.6 and 50 micrometers depth. The results depended not only on the feature width and depth, but also on whether the features were isolated or in line and space patterns. Using a BSE ratio of 1.05 as a criterion for acceptable contrast from an alignment mark, V-grooves and vertical etched features had acceptable contrast with exception of the smallest and shallowest features for both geometries.

Paper Details

Date Published: 27 May 1996
PDF: 7 pages
Proc. SPIE 2723, Electron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing VI, (27 May 1996); doi: 10.1117/12.240464
Show Author Affiliations
Reginald C. Farrow, AT&T Bell Labs. (United States)
Masis M. Mkrtchyan, AT&T Bell Labs. (United States)
Kevin Bolen, AT&T Bell Labs. (United States)
Myrtle I. Blakey, AT&T Bell Labs. (United States)
Christopher J. Biddick, AT&T Bell Labs. (United States)
Linus A. Fetter, AT&T Bell Labs. (United States)
Harold A. Huggins, AT&T Bell Labs. (United States)
Regine G. Tarascon-Auriol, AT&T Bell Labs. (United States)
Steven D. Berger, AT&T Bell Labs. (United States)

Published in SPIE Proceedings Vol. 2723:
Electron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing VI
David E. Seeger, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?