In contrast to other experimental methods which have just two or three settings per variable, the rationale is presented for using a large number of stepper exposures at poly or active area for certain applications (such as obtaining high correlation to E-TEST variables). How variables (which are dependent on linewidth) relate to each other can also be determined to high correlation; even linear correlation of measured poly linewidth to speed had an R² value of 0.96. This experimental method is useful for numerous applications such as: process characterization, budgeting of CD linewidths, and correlating process variables to electrical data. Useful data analysis techniques are also shown. The experimental method is also cost- effective, requiring a small number of wafers.

Date Published: 21 May 1996
PDF: 7 pages
Proc. SPIE 2725, Metrology, Inspection, and Process Control for Microlithography X, (21 May 1996);

Published in SPIE Proceedings Vol. 2725:
Metrology, Inspection, and Process Control for Microlithography X
Susan K. Jones, Editor(s)