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Proceedings Paper

Smart earthquake-resistant materials: using time-released adhesives for damping, stiffening, and deflection control
Author(s): Carolyn M. Dry
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Paper Abstract

Preventing buildings and bridges from damage from severe dynamic loading events is a primary goal of civil infrastructure. Present designs attempt to control structural response by making the structures more massive, by increasing lateral stiffness through bracing, and by damping technology such as mass damping and base-isolation. These attempts affect portions of the governing equation: for an idealized building frame or bridge, the free vibrational behavior is described by Mu + cu + ku equals -mug(t) where m equals mass, c equals damping coefficient, k equals lateral stiffness, u equals deflection, and ug(t) equals ground acceleration. The use of adhesive released internally in a material based way of addressing the problem. The time release of low modulus adhesive chemicals would assist the damping characteristics of the structure, use of a stiffer adhesive would allow the damaged structure to regain some lateral stiffness (k) and adjustment of the set times of the adhesives would act to control the deflection. These can be thought of as potential new method of controlling vibration of behavior in case of a dynamic loading event. In past experiments, self-healing concrete matrices were shown to increase post-yield deflection and load carrying capability by the release and setting of adhesives. The results were promising in resisting damage of dynamic loads applied to frames. This indicates that self-healing concrete would be extremely valuable in civil engineering structures that were subjected to failure-inducing loads such as earthquakes.

Paper Details

Date Published: 26 April 1996
PDF: 10 pages
Proc. SPIE 2779, 3rd International Conference on Intelligent Materials and 3rd European Conference on Smart Structures and Materials, (26 April 1996); doi: 10.1117/12.237085
Show Author Affiliations
Carolyn M. Dry, Univ. of Illinois/Urbana-Champaign (United States)

Published in SPIE Proceedings Vol. 2779:
3rd International Conference on Intelligent Materials and 3rd European Conference on Smart Structures and Materials
Pierre Francois Gobin; Jacques Tatibouet, Editor(s)

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