Share Email Print

Proceedings Paper

Thermal considerations of free-space optical interconnects using VCSEL-based smart pixel arrays
Author(s): John A. Neff
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

This paper discusses free-space optical interconnects from four perspectives: need, system architectures, major enabling technology, and component and system packaging. The need for such interconnection in telecommunication/datacommunication switching networks and fine- grained parallel computers is described. Since most of the envisioned systems fall into the two architectural classes of optical backplanes and 3-D systems, the paper describes these classes in detail. And the reader is introduced to the major enabling technology of smart pixel arrays. Finally, the paper describes attempts to implement free-space optical interconnect systems and some of the interesting thermal management issues that these implementations raise.

Paper Details

Date Published: 29 March 1996
PDF: 12 pages
Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); doi: 10.1117/12.236917
Show Author Affiliations
John A. Neff, Univ. of Colorado/Boulder (United States)

Published in SPIE Proceedings Vol. 2691:
Optoelectronic Packaging
Michael R. Feldman; Yung-Cheng Lee, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?