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Proceedings Paper

Single-mode array optoelectronic packaging based on actively aligned planar optical waveguides
Author(s): Robert F. Kalman; Edward R. Silva; Daniel F. Knapp
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Paper Abstract

Packaging of integrated optoelectronic devices (e.g., laser diode arrays and OEICs) is motivated by potential cost savings and the increased functionality of more highly integrated devices. To date, attempts to package integrated optoelectronic devices with arrays of single- mode fibers have tended to exhibit high optical losses. We have developed a single-mode array packaging process based on the use of an intermediate silica-on-silicon planar optical waveguides (POWs) assembly to which optical fibers are attached using V-grooves. By lensing the POWs, we have achieved coupling efficiencies of greater than 50%. The photolithographic registration of the POWs allows a large (greater than or equal to 8) array of POWs with attached fibers to be aligned to an array of optoelectronic devices in a single active alignment procedure. This single active alignment step is well-suited to automation, and our approach is thus well-suited to achieving low cost in a manufacturing environment. We also discuss our positioning and mounting techniques, which provide high-stability coupling in adverse temperature and vibration environments and are compatible with hermetic packaging.

Paper Details

Date Published: 29 March 1996
PDF: 6 pages
Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); doi: 10.1117/12.236914
Show Author Affiliations
Robert F. Kalman, Optivision Inc. (United States)
Edward R. Silva, Optivision Inc. (United States)
Daniel F. Knapp, Optivision Inc. (United States)

Published in SPIE Proceedings Vol. 2691:
Optoelectronic Packaging
Michael R. Feldman; Yung-Cheng Lee, Editor(s)

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