Share Email Print

Proceedings Paper

rf optoelectronic transmitter and receiver arrays on silicon wafer boards
Author(s): Daniel Yap; Willie W. Ng; Deborah M. Bohmeyer; Hui Pin Hsu; Huan-Wun Yen; Marvin J. Tabasky; Andrew J. Negri; Joseph Mehr; Craig A. Armiento; Paul O. Haugsjaa
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Silicon waferboard technology based on etched and deposited passive-alignment features has been applied to the fabrication of optoelectronic transmitter and receiver arrays for rf applications. Using silicon waferboards, we have aligned both 1 by 4 buried-heterostructure laser arrays and 1 by 4 PIN photodetector arrays to optical fiber ribbons. Besides serving as mechanical carriers and alignment guides, the silicon wafers can also be used as rf or microwave substrates. We introduce rf-optoelectronic receiver arrays based on such enhanced silicon waferboards.

Paper Details

Date Published: 29 March 1996
PDF: 8 pages
Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); doi: 10.1117/12.236912
Show Author Affiliations
Daniel Yap, Hughes Research Labs. (United States)
Willie W. Ng, Hughes Research Labs. (United States)
Deborah M. Bohmeyer, Hughes Research Labs. (United States)
Hui Pin Hsu, Hughes Research Labs. (United States)
Huan-Wun Yen, Hughes Research Labs. (United States)
Marvin J. Tabasky, GTE Labs. Inc. (United States)
Andrew J. Negri, GTE Labs. Inc. (United States)
Joseph Mehr, GTE Labs. Inc. (United States)
Craig A. Armiento, GTE Labs. Inc. (United States)
Paul O. Haugsjaa, GTE Labs. Inc. (United States)

Published in SPIE Proceedings Vol. 2691:
Optoelectronic Packaging
Michael R. Feldman; Yung-Cheng Lee, Editor(s)

© SPIE. Terms of Use
Back to Top