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Proceedings Paper

Infrared thermal analysis of ski and snowboard binding systems
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Paper Abstract

Analysis offriction in binding systems has been a subject of interest to researchers and binding manufacturers. During the ski binding release process, frictional energy is dissipated on anti-friction devices, toe or heel lugs and other components that contact the boot prior to release. The energy dissipation patterns are readily observable using infrared thermographic means. Several tests were performed on a ski binding/boot system under combined as well as pure torque loading. Thermal patterns are presented and interpreted. Thermal signatures on anti-friction devices under combined loading are significantly different from that ofpure torque loading. Snowboard binding systems were also analyzed as to energy dissipation during flexing and extension modes. Energy dissipation in the polymer binding material yields information as to the extent of bending in the binding material. Also, thermal signatures from rubbing ofboots in the binding is readily apparent. Thermograms are presented illustrating highly stressed areas in the binding as well as indicators offuture wear in the binding systems. Infrared thermography is a useful research tool in analyzing the effects ofboots on both ski and snowboard binding systems. Keywords: binding friction, binding release, ski binding/boot system, thermal signatures, snowboard binding/boot system, energy dissipation, polymer binding material, infrared thermography, binding stressed areas, binding wear.

Paper Details

Date Published: 15 March 1996
PDF: 11 pages
Proc. SPIE 2766, Thermosense XVIII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications, (15 March 1996); doi: 10.1117/12.235393
Show Author Affiliations
Charles C. Roberts Jr., C. Roberts Consulting Engineers, Inc. (United States)

Published in SPIE Proceedings Vol. 2766:
Thermosense XVIII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications
Douglas D. Burleigh; Jane W. Maclachlan Spicer, Editor(s)

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