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Proceedings Paper

Mechanical properties of LEDs bonds realized with conductive adhesives paste
Author(s): Mihai Branzei; Marian Vladescu; Ioan Plotog; Gaudentiu Varzaru; Bogdan Mihailescu
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Paper Abstract

The SW150 and the new types SW180 of Electrically Conductive Adhesives (ECA) dedicated to printing circuits1, meeting RoHS EU Directive2, were used, according to REACH EU Regulation3, to bond optoelectronics components, LED type, on test printed circuit boards (TPCBs) having daisy chain interconnection structures. Mechanical properties of LEDs bonds function of temperatures by measuring shear forces applied on each of bonded LEDs maintaining TPCBs at different temperature from ambient to 398 K (125°C), were investigated. The shear forces measured values, the LEDs bonds micro sections and the microfractography after shear testes analyses and interpretations, facilitate the construction of a database that provides support for the development of temperature-sensitive optoelectronic device assembling solutions by bonding, using ECA. These solutions ensure avoidance of their functional temperature failures during classical assembly processes, comparing ECA curing and reflow temperatures.

Paper Details

Date Published: 31 December 2018
PDF: 8 pages
Proc. SPIE 10977, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IX, 109770I (31 December 2018); doi: 10.1117/12.2326206
Show Author Affiliations
Mihai Branzei, Univ. Politehnica of Bucharest (Romania)
Marian Vladescu, Univ. Politehnica of Bucharest (Romania)
Ioan Plotog, Univ. Politehnica of Bucharest (Romania)
Gaudentiu Varzaru, Syswin Solutions (Romania)
Bogdan Mihailescu, Univ. Politehnica of Bucharest (Romania)

Published in SPIE Proceedings Vol. 10977:
Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IX
Marian Vladescu; Razvan D. Tamas; Ionica Cristea, Editor(s)

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