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Proceedings Paper

Packaging issues for free-space interconnects at the board level
Author(s): Raymond K. Kostuk
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Paper Abstract

Many researchers have propsed free-space optical interconnects as an alternative to electrical and optical guided wave techniques for connecting electronic or optical processors1,2. However little discussion has been given to problems associated with system packaging. This presentation provides an overview of several important issues in yjis area which must be solved prior to realizing free-space optical interconnect systems.

Paper Details

Date Published: 1 December 1991
Proc. SPIE 1563, Optical Enhancements to Computing Technology, (1 December 1991); doi: 10.1117/12.2321748
Show Author Affiliations
Raymond K. Kostuk, Univ. of Arizona (United States)

Published in SPIE Proceedings Vol. 1563:
Optical Enhancements to Computing Technology
John A. Neff, Editor(s)

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