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Proceedings Paper

Diamond multichip modules
Author(s): Tracy D. McSheery
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Paper Abstract

Diamond's thermal, mechanical, chemical, electrical and optical properties are ideally suited to the requirements of multichip modules. Gigahertz clock rates and increased device density are facilitated using diamond as a base material and as a hermetic passivation layer. Three dimensional architectures with optical communications would allow high speed communications for advanced designs in computers and rugged electronics. This paper provides an overview of potential applications and advantages of Diamond Multichip Modules.

Paper Details

Date Published: 1 December 1991
Proc. SPIE 1563, Optical Enhancements to Computing Technology, (1 December 1991); doi: 10.1117/12.2321734
Show Author Affiliations
Tracy D. McSheery, Univ. of California, Davis (United States)

Published in SPIE Proceedings Vol. 1563:
Optical Enhancements to Computing Technology
John A. Neff, Editor(s)

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