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Proceedings Paper

Manufacturability and performance of 2.3-µm HgCdTe H2RG sensor chip assemblies for Euclid
Author(s): Yibin Bai; Mark Farris; Lisa Fischer; Jessica Maiten; Robert Kopp; Eric Piquette; Jon Ellsworth; Aristo Yulius; Annie Chen; Stephanie Tallarico; Elizabeth Hernandez; Eric Holland; Ellen Boehmer; Michael Carmody ; James W. Beletic; Hyung Cho; Warren Holmes; Michael Seiffert ; Steven Pravdo; Murzy Jhabvala; Augustyn Waczynski
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Paper Abstract

The detector system for the Euclid Near-Infrared Spectrometer and Photometer (NISP) instrument is a 4×4 mosaic focal plane of 16 H2RG (2K×2K pixels) infrared Sensor Chip Assemblies (SCAs) and 16 SIDECAR ASIC Sensor Chip Electronics (SCE) modules. Teledyne has successfully completed the fabrication, testing, and delivery of 24 sciencegrade flight candidate SCAs to the NASA Jet Propulsion Laboratory (JPL). These SCAs were made with Teledyne’s TRL-9 substrate-removed MBE mercury cadmium telluride (HgCdTe) 2.3 μm cutoff detector material and low-noise H2RG CMOS readout chip. The SCAs are mounted on a buttable molybdenum package that enables close packing of the 16 flight SCAs in the NISP focal plane. In this paper, we present the test results of the 24 Euclid flight candidate SCAs. The key detector performance parameters that are critical to the NISP instrument are: high in-band quantum efficiency with good spatial uniformity, low readout noise, low dark current with tight distribution, low pixel crosstalk, low persistence, and good detector surface metrology profile. All 24 SCAs exceed the Euclid NISP performance and interface requirements. The additional acceptance testing at JPL and NASA Goddard’s Detector Characterization Lab has also been completed. 20 flight SCAs have been delivered to European Space Agency (ESA).

Paper Details

Date Published: 10 July 2018
PDF: 15 pages
Proc. SPIE 10709, High Energy, Optical, and Infrared Detectors for Astronomy VIII, 1070915 (10 July 2018); doi: 10.1117/12.2317733
Show Author Affiliations
Yibin Bai, Teledyne Imaging Sensors (United States)
Mark Farris, Teledyne Imaging Sensors (United States)
Lisa Fischer, Teledyne Imaging Sensors (United States)
Jessica Maiten, Teledyne Imaging Sensors (United States)
Robert Kopp, Teledyne Imaging Sensors (United States)
Eric Piquette, Teledyne Imaging Sensors (United States)
Jon Ellsworth, Teledyne Imaging Sensors (United States)
Aristo Yulius, Teledyne Imaging Sensors (United States)
Annie Chen, Teledyne Imaging Sensors (United States)
Stephanie Tallarico, Teledyne Imaging Sensors (United States)
Elizabeth Hernandez, Teledyne Imaging Sensors (United States)
Eric Holland, Teledyne Imaging Sensors (United States)
Ellen Boehmer, Teledyne Imaging Sensors (United States)
Michael Carmody , Teledyne Imaging Sensors (United States)
James W. Beletic, Teledyne Imaging Sensors (United States)
Hyung Cho, Jet Propulsion Lab. (United States)
Warren Holmes, Jet Propulsion Lab. (United States)
Michael Seiffert , Jet Propulsion Lab. (United States)
Steven Pravdo, Jet Propulsion Lab. (United States)
Murzy Jhabvala, NASA Goddard Space Flight Ctr. (United States)
Augustyn Waczynski, NASA Goddard Space Flight Ctr. (United States)

Published in SPIE Proceedings Vol. 10709:
High Energy, Optical, and Infrared Detectors for Astronomy VIII
Andrew D. Holland; James Beletic, Editor(s)

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