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Proceedings Paper

Industrialization of a robust EUV source for high-volume manufacturing and power scaling beyond 250W
Author(s): Michael Purvis; Igor V. Fomenkov; Alexander A. Schafgans; Mike Vargas; Spencer Rich; Yezheng Tao; Slava I. Rokitski; Melchior Mulder; Erik Buurman; Michael Kats; Jayson Stewart; Andrew D. LaForge; Chirag Rajyaguru; Georgiy Vaschenko; Alex I. Ershov; Robert J. Rafac; Mathew Abraham; David C. Brandt; Daniel J. Brown
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Paper Abstract

In this paper, we provide an overview of various technologies for scaling tin laser-produced-plasma (LPP) extremeultraviolet (EUV) source performance to enable high volume manufacturing (HVM). We will show improvements to source architecture that facilitated the increase of EUV power from 100W to 250W, and the technical challenges for power scaling of key source parameters and subsystems. The performance of critical subsystems such as the Droplet Generator and Collector protection will be shown, with emphasis on stability and lifetime. Finally, we will describe current research activities and provide a perspective for LPP EUV sources towards 500W.

Paper Details

Date Published: 10 May 2018
PDF: 10 pages
Proc. SPIE 10583, Extreme Ultraviolet (EUV) Lithography IX, 1058327 (10 May 2018); doi: 10.1117/12.2305955
Show Author Affiliations
Michael Purvis, ASML US LP (United States)
Igor V. Fomenkov, ASML US LP (United States)
Alexander A. Schafgans, ASML US LP (United States)
Mike Vargas, ASML US LP (United States)
Spencer Rich, ASML US LP (United States)
Yezheng Tao, ASML US LP (United States)
Slava I. Rokitski, ASML US LP (United States)
Melchior Mulder, ASML US LP (United States)
Erik Buurman, ASML US LP (United States)
Michael Kats, ASML US LP (United States)
Jayson Stewart, ASML US LP (United States)
Andrew D. LaForge, ASML US LP (United States)
Chirag Rajyaguru, ASML US LP (United States)
Georgiy Vaschenko, ASML US LP (United States)
Alex I. Ershov, ASML US LP (United States)
Robert J. Rafac, ASML US LP (United States)
Mathew Abraham, ASML US LP (United States)
David C. Brandt, ASML US LP (United States)
Daniel J. Brown, ASML US LP (United States)

Published in SPIE Proceedings Vol. 10583:
Extreme Ultraviolet (EUV) Lithography IX
Kenneth A. Goldberg, Editor(s)

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