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Proceedings Paper • Open Access

Chip scale package fiber optic transceiver integration for harsh environments

Paper Abstract

We present fiber optic technology for 850 nm, VCSEL-based embedded optical computing solutions. We introduce concepts for compact, rugged fiber optic transceivers that provide multi-channel operation at 12.5 Gbps per channel. The transceiver can be placed in close proximity to high performance ASICs to provide direct optical I/O between components. The transceiver is packaged with material having match coefficients of thermal expansion (CTE), and expanded beam optical interface – these features offer survivability and operation over wide temperature ranges.

Paper Details

Date Published: 17 November 2017
PDF: 6 pages
Proc. SPIE 10563, International Conference on Space Optics — ICSO 2014, 1056335 (17 November 2017); doi: 10.1117/12.2304174
Show Author Affiliations
Chuck Tabbert, Ultra Communications, Inc. (United States)
Charles Kuznia, Ultra Communications, Inc. (United States)

Published in SPIE Proceedings Vol. 10563:
International Conference on Space Optics — ICSO 2014
Zoran Sodnik; Bruno Cugny; Nikos Karafolas, Editor(s)

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