This paper describes the development of laser transmitter arrays for analog optoelectronic link applications up to 2 GHz. These modules have been developed in an attempt to utilize passive assembly and alignment operations for the purpose of reducing costs. To this end, silicon waferboard integration platforms and semiconductor laser arrays have been fabricated with special alignment features that allow passive assembly of flip-chip laser arrays to single-mode optical fiber arrays.

Date Published: 15 January 1996
PDF: 9 pages
Proc. SPIE 2610, Laser Diode Chip and Packaging Technology, (15 January 1996); doi: 10.1117/12.230078

Published in SPIE Proceedings Vol. 2610:
Laser Diode Chip and Packaging Technology
Pei Chuang Chen; Tomas D. Milster, Editor(s)