Share Email Print

Proceedings Paper • Open Access

Understanding fundamental limitations of materials to enable advanced design
Author(s): Meredith Reed; Jagmohan Bajaj; Francesco Bertazzi; Enrico Bellotti; Jonathan Schuster; Philip Perconti

Paper Abstract

Future and advanced sensor technologies needed for DoD applications will require more efficient semiconductor materials and devices. Pushing sensor device performance beyond present levels requires a deep understanding of the fundamental limiters. Therefore fundamental research is needed to assure transition of technology from demonstration to system deployment. To address this problem, the Army Research Laboratory (ARL) and Boston University (BU) have come together to create a BU led Consortium for semiconductor Modeling of Materials and Devices (CSM). The Consortium brings together government, academia, and industry in a collaborative fashion to continuously push semiconductor research forward to meet DoD needs. The leveraged attributes of the Consortium include combined broad knowledge base in semiconductor modeling, materials growth and device expertise; sharing of computational resources; project continuity; and extension of the bench. Details regarding the Consortium’s first research topic on understanding vertical transport in Type 2 SL will be discussed.

Paper Details

Date Published: 26 January 2018
PDF: 6 pages
Proc. SPIE 10540, Quantum Sensing and Nano Electronics and Photonics XV, 1054005 (26 January 2018); doi: 10.1117/12.2300711
Show Author Affiliations
Meredith Reed, U.S. Army Research Lab. (United States)
Jagmohan Bajaj, U.S. Army Research Lab. (United States)
Francesco Bertazzi, Politecnico di Torino (Italy)
Enrico Bellotti, Boston Univ. (United States)
Jonathan Schuster, U.S. Army Research Lab. (United States)
Philip Perconti, U.S. Army Research Lab. (United States)

Published in SPIE Proceedings Vol. 10540:
Quantum Sensing and Nano Electronics and Photonics XV
Manijeh Razeghi; Gail J. Brown; Jay S. Lewis; Giuseppe Leo, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?