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Proceedings Paper

Thermal cycling of shape memory alloy wires using semiconductor heat pump modules
Author(s): Mark A. Thrasher
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Paper Abstract

This paper introduces a novel concept of using semiconductor heat pumpmodules to heat and cool Nitinol shape memory alloy (SMA) wires in an effort to reducethe response time for complete thermal cycling. An analytical heat transfer model isdeveloped to provide a quantitative comparison between the effectiveness of semiconductormodules and other conventional modes of heating and cooling SMA wires. Results of theheat transfer modeling indicate that semiconductor heat pump modules can reduceheating/cooling cycle time by an order of magnitude compared to free or forced convectionalone.

Paper Details

Date Published: 1 May 1992
PDF: 4 pages
Proc. SPIE 1777, First European Conference on Smart Structures and Materials, 177714 (1 May 1992); doi: 10.1117/12.2298063
Show Author Affiliations
Mark A. Thrasher, Purdue Univ. (United States)

Published in SPIE Proceedings Vol. 1777:
First European Conference on Smart Structures and Materials
Brian Culshaw; Peter T. Gardiner; Alaster McDonach, Editor(s)

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