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Proceedings Paper

EUV via hole pattern fidelity enhancement through novel resist and post-litho plasma treatment
Author(s): Hidetami Yaegashi; Kyohei Koike; Carlos Fonseca; Fumiko Yamashita; Kumar Kaushik; Shinya Morikita; Kiyohito Ito; Shota Yoshimura; Vadim Timoshkov; Mark Maslow; Tae Kwon Jee; Liesbeth Reijnen; Peter Choi; Mu Feng; Chris Spence; Stijn Schoofs
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Paper Abstract

Extreme UV(EUV) technology must be potential solution for sustainable scaling, and its adoption in high volume manufacturing(HVM) is getting realistic more and more. This technology has a wide capability to mitigate various technical problem in Multi-patterning (LELELE) for via hole patterning with 193-i. It induced local pattern fidelity error such like CDU, CER, Pattern placement error. Exactly, EUV must be desirable scaling-driving tool, however, specific technical issue, named RLS (Resolution-LER-Sensitivity) triangle, obvious remaining issue. In this work, we examined hole patterning sensitizing (Lower dose approach) utilizing hole patterning restoration technique named “CD-Healing” as post-Litho. treatment.

Paper Details

Date Published: 13 March 2018
PDF: 5 pages
Proc. SPIE 10586, Advances in Patterning Materials and Processes XXXV, 1058605 (13 March 2018); doi: 10.1117/12.2297661
Show Author Affiliations
Hidetami Yaegashi, Tokyo Electron Ltd. (Japan)
Kyohei Koike, Tokyo Electron Ltd. (Japan)
Carlos Fonseca, Tokyo Electron America, Inc. (United States)
Fumiko Yamashita, Tokyo Electron America, Inc. (United States)
Kumar Kaushik, ASML US, Inc. (United States)
Shinya Morikita, Tokyo Electron Miyagi Ltd. (Japan)
Kiyohito Ito, Tokyo Electron Miyagi Ltd. (Japan)
Shota Yoshimura, Tokyo Electron Miyagi Ltd. (Japan)
Vadim Timoshkov, ASML Netherlands B.V. (Netherlands)
Mark Maslow, ASML Netherlands B.V. (Netherlands)
Tae Kwon Jee, ASML Netherlands B.V. (Netherlands)
Liesbeth Reijnen, ASML Netherlands B.V. (Netherlands)
Peter Choi, ASML US, Inc. (United States)
Mu Feng, ASML US, Inc. (United States)
Chris Spence, ASML US, Inc. (United States)
Stijn Schoofs, IMEC (Belgium)

Published in SPIE Proceedings Vol. 10586:
Advances in Patterning Materials and Processes XXXV
Christoph K. Hohle, Editor(s)

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