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Proceedings Paper

Model based cell-array OPC development for productivity improvement in memory device fabrication
Author(s): Ahmed Seoud; Sherif Hany; Juhwan Kim; Jebum Yoon; Boram Jung; Sang-Jin Oh; Byoung-Sub Nam; Seyoung Oh; Chan-Ha Park
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Paper Abstract

Traditionally, optical proximity correction (OPC) on cell array patterns in memory layout uses simple bias rules to correct hierarchically-placed features, but requires intensive, rigorous lithographic simulations to maximize the wafer process latitude. This process requires time-consuming procedures to be performed on the full chip (excluding the cell arrays) to handle unique cell features and layout placements before (and even sometimes after) OPC. The time required limits productivity for both mask tapeouts and the wafer process development. In this paper, a new cell array OPC flow is introduced that reduces turnaround-time for mask tapeouts from days to hours, while maintaining acceptable OPC quality and the perfect geometric consistency on the OPC output that is critical for memory manufacturing. The flow comprises an effective sub-resolution assist features (SRAFs) insertion and OPC for both the cell array and the peripheral pattern areas. Both simulation and experimental results from actual wafer verification are discussed.

Paper Details

Date Published: 20 March 2018
PDF: 6 pages
Proc. SPIE 10587, Optical Microlithography XXXI, 105870K (20 March 2018); doi: 10.1117/12.2297638
Show Author Affiliations
Ahmed Seoud, Mentor Graphics Corp. (United States)
Sherif Hany, Mentor Graphics Corp. (United States)
Juhwan Kim, Mentor Graphics Corp. (United States)
Jebum Yoon, Mentor Graphics (Korea) LLC. (Korea, Republic of)
Boram Jung, Mentor Graphics (Korea) LLC. (Korea, Republic of)
Sang-Jin Oh, SK Hynix, Inc. (Korea, Republic of)
Byoung-Sub Nam, SK Hynix, Inc. (Korea, Republic of)
Seyoung Oh, SK Hynix, Inc. (Korea, Republic of)
Chan-Ha Park, SK Hynix, Inc. (Korea, Republic of)

Published in SPIE Proceedings Vol. 10587:
Optical Microlithography XXXI
Jongwook Kye, Editor(s)

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