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Proceedings Paper

EUVL back-insertion layout optimization
Author(s): D. Civay; E. Laffosse; A. Chesneau
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Paper Abstract

Extreme ultraviolet lithography (EUVL) is targeted for front-up insertion at advanced technology nodes but will be evaluated for back insertion at more mature nodes. EUVL can put two or more mask levels back on one mask, depending upon what level(s) in the process insertion occurs. In this paper, layout optimization methods are discussed that can be implemented when EUVL back insertion is implemented. The layout optimizations can be focused on improving yield, reliability or density, depending upon the design needs. The proposed methodology modifies the original two or more colored layers and generates an optimized single color EUVL layout design.

Paper Details

Date Published: 19 March 2018
PDF: 9 pages
Proc. SPIE 10583, Extreme Ultraviolet (EUV) Lithography IX, 1058313 (19 March 2018); doi: 10.1117/12.2297122
Show Author Affiliations
D. Civay, GLOBALFOUNDRIES Inc. (United States)
E. Laffosse, GLOBALFOUNDRIES Inc. (United States)
A. Chesneau, GLOBALFOUNDRIES Inc. (United States)


Published in SPIE Proceedings Vol. 10583:
Extreme Ultraviolet (EUV) Lithography IX
Kenneth A. Goldberg, Editor(s)

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