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Proceedings Paper • Open Access

High speed TDI embedded CCD in CMOS sensor
Author(s): P. Boulenc; J. Robbelein; L. Wu; L. Haspeslagh; P. De Moor; J. Borremans; M. Rosmeulen

Paper Abstract

This paper reports on a Time Delay and Integration image sensor System-on-Chip realized in an embedded CCD process. The integration of single-poly CCD modules into a standard 0.13?m CMOS process is discussed. The technology performance has been evaluated using dedicated test structures. Next, a prototype TDI imager with 5?m pixel pitch, 512 rows and 1024 columns was designed, manufactured and characterized. Charge Transfer Efficiency greater than 0.9999 up till very high line rates of 400kHz was recorded.

Paper Details

Date Published: 25 September 2017
PDF: 7 pages
Proc. SPIE 10562, International Conference on Space Optics — ICSO 2016, 105622P (25 September 2017); doi: 10.1117/12.2296149
Show Author Affiliations
P. Boulenc, IMEC (Belgium)
J. Robbelein, IMEC (Belgium)
L. Wu, IMEC (Belgium)
L. Haspeslagh, IMEC (Belgium)
P. De Moor, IMEC (Belgium)
J. Borremans, IMEC (Belgium)
M. Rosmeulen, IMEC (Belgium)

Published in SPIE Proceedings Vol. 10562:
International Conference on Space Optics — ICSO 2016
Bruno Cugny; Nikos Karafolas; Zoran Sodnik, Editor(s)

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