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Proceedings Paper

Study of CFRP adhesive bonds influenced by manufacturing-related contaminations
Author(s): Pawel H. Malinowski; Tomasz Wandowski; Wieslaw M. Ostachowicz; Angelos Christopoulos; Ilias Koulalis; Konstantinos Kitsianos; George Kanterakis; Romain Ecault; Rainer Stoessel; Damien Segur; Laurent Berthe; Maxime Sagnard; Fabienne Touchard; Michel Boustie; Welchy Leite Cavalcanti; Kai Brune
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Paper Abstract

Composite materials are commonly used in many branches of industry. One of the effective methods to join CFRP parts is the adhesive bonding. There is a search of effective methods for quality assurance of bonded parts. There is a need for pre- and post-bond inspection to ensure proper bonding and verify its quality. Research reported here focuses on post-bond inspection of bonded CFRP parts. In this paper we report investigations of samples that were modified with contamination that can be encountered during the manufacturing process of the CFRP parts. The contaminations were introduced before adhesive bonding, and the effect of the contamination on the quality bond is studied. First of the investigated cases was release agent contamination prepared by dip-coating of clean CFRP plates. The release agent is used during the production of composite elements and can contaminate the surface to be bonded. The second case was the moisture contamination. It was obtained by conditioning of the samples in humid conditions. Moisture contamination can be gained from water-coupled ultrasonics or during transportation of unprotected parts. The third type of contamination had more local character. It simulated fingerprints. Artificial sweat was used. The fingerprint contamination can be caused by improper handling of the parts. Apart from single contamination, also mixed contamination cases were studied, as well as curved samples. The samples were studied in non-destructive approach. It was shown that for some of the cases the detection is possible.

Paper Details

Date Published: 27 March 2018
PDF: 13 pages
Proc. SPIE 10598, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2018, 105980B (27 March 2018); doi: 10.1117/12.2294511
Show Author Affiliations
Pawel H. Malinowski, Institute of Fluid-Flow Machinery (Poland)
Tomasz Wandowski, Institute of Fluid-Flow Machinery (Poland)
Wieslaw M. Ostachowicz, Institute of Fluid-Flow Machinery (Poland)
Angelos Christopoulos, GMI Aero SAS (France)
Ilias Koulalis, GMI Aero SAS (France)
Konstantinos Kitsianos, GMI Aero SAS (France)
George Kanterakis, GMI Aero SAS (France)
Romain Ecault, Airbus Operations S.A.S. (France)
Rainer Stoessel, Airbus Group Innovations (Germany)
Damien Segur, CEA Tech Occitanie (France)
Laurent Berthe, PIMM, CNRS-ENSAM Paristech (France)
Maxime Sagnard, PIMM, CNRS-ENSAM Paristech (France)
Fabienne Touchard, Univ. de Poitiers (France)
Michel Boustie, Univ. de Poitiers (France)
Welchy Leite Cavalcanti, Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung (Germany)
Kai Brune, Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung (Germany)

Published in SPIE Proceedings Vol. 10598:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2018
Hoon Sohn, Editor(s)

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