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Proceedings Paper

Board-to-board free-space optical interconnects of bus architecture
Author(s): Jian Ma; Volkan H. Ozguz; Sing H. Lee
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Paper Abstract

This paper presents the concepts of a board-to-board free space optical interconnection scheme that will support a bus architecture. While the technology required to implement this optical scheme is very compatible with existing electronic packaging technologies, it promises to be able interconnect many more boards together without serious impedance matching or termination problems encountered by electrical interconnects at high speed. Experimental demonstration of the optical scheme is in progress.

Paper Details

Date Published: 30 January 1996
PDF: 4 pages
Proc. SPIE 10284, Optoelectronic Interconnects and Packaging: A Critical Review, 1028404 (30 January 1996); doi: 10.1117/12.229279
Show Author Affiliations
Jian Ma, Univ. of California, San Diego (United States)
Volkan H. Ozguz, Univ. of California, San Diego (United States)
Sing H. Lee, Univ. of California, San Diego (United States)


Published in SPIE Proceedings Vol. 10284:
Optoelectronic Interconnects and Packaging: A Critical Review
Ray T. Chen; Peter S. Guilfoyle, Editor(s)

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