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Proceedings Paper

Packaging of silicon photonic devices: from prototypes to production
Author(s): Padraic E. Morrissey; Kamil Gradkowski; Lee Carroll; Peter O'Brien
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Paper Abstract

The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.

Paper Details

Date Published: 22 February 2018
PDF: 6 pages
Proc. SPIE 10537, Silicon Photonics XIII, 105370L (22 February 2018); doi: 10.1117/12.2292674
Show Author Affiliations
Padraic E. Morrissey, Tyndall National Institute (Ireland)
Kamil Gradkowski, Tyndall National Institute (Ireland)
Lee Carroll, Tyndall National Institute (Ireland)
Peter O'Brien, Tyndall National Institute (Ireland)

Published in SPIE Proceedings Vol. 10537:
Silicon Photonics XIII
Graham T. Reed; Andrew P. Knights, Editor(s)

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