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Proceedings Paper

VCSEL-based optical interconnections at interbox distances and shorter
Author(s): Jack L. Jewell
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Paper Abstract

Optics will soon established as the mainstay for data-intensive communications at distances about 100 meters or less between workstations, displays and peripherals. The datacom hardware includes of arrays of multi-mode vertical-cavity surface-emitting lasers (VCSELs) emitting in the 650-1000 nm range and parallel channels of multi-mode optical fiber, which are major departures from the already-established long-distance optical fiber communications for telecom. These radical departures are brought about by two major forces. (1) They are forced by the driving need to reduce costs for datacom links to the consumer affordability level, as opposed to the network provider level in telecom links. (2) They are allowed by the different requirements of the shorter communication distances. In the future, optics is expected to replace traditional communication links at even shorter distances. If optical communications extends down to the inter-chip level, it is likely that the “chipcom” links will require technologies as different from datacom technologies as VCSEL arrays and fiber ribbons are from distributed feedback lasers and single-mode fibers. In this paper are reviewed the forces which shape the emerging datacom hardware, current state of datacom links, and a cmde forecast of what will be required for chipcom links.

Paper Details

Date Published: 30 January 1996
PDF: 15 pages
Proc. SPIE 10284, Optoelectronic Interconnects and Packaging: A Critical Review, 102840C (30 January 1996); doi: 10.1117/12.229264
Show Author Affiliations
Jack L. Jewell, Picolight Inc. (United States)

Published in SPIE Proceedings Vol. 10284:
Optoelectronic Interconnects and Packaging: A Critical Review
Ray T. Chen; Peter S. Guilfoyle, Editor(s)

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