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Proceedings Paper

Programmed LWR metrology by multi-techniques approach
Author(s): Jérôme Reche; Maxime Besacier; Patrice Gergaud; Yoann Blancquaert; Guillaume Freychet; Thibault Labbaye
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Paper Abstract

Nowadays, roughness control presents a huge challenge for the lithography step. For advanced nodes, this morphological aspect reaches the same order of magnitude than the Critical Dimension. Hence, the control of roughness needs an adapted metrology. In this study, specific samples with designed roughness have been manufactured using e-beam lithography. These samples have been characterized with three different methodologies: CD-SEM, OCD and SAXS. The main goal of the project is to compare the capability of each of these techniques in terms of reliability, type of information obtained, time to obtain the measurements and level of maturity for the industry.

Paper Details

Date Published: 13 March 2018
PDF: 14 pages
Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105850F (13 March 2018); doi: 10.1117/12.2292169
Show Author Affiliations
Jérôme Reche, CEA-LETI, MINATEC (France)
Univ. Grenoble Alpes (France)
Maxime Besacier, Univ. Grenoble Alpes (France)
Patrice Gergaud, CEA-LETI, MINATEC (France)
Yoann Blancquaert, CEA-LETI, MINATEC (France)
Guillaume Freychet, Lawrence Berkeley National Lab. (United States)
Thibault Labbaye, CEA-LETI, MINATEC (France)

Published in SPIE Proceedings Vol. 10585:
Metrology, Inspection, and Process Control for Microlithography XXXII
Vladimir A. Ukraintsev, Editor(s)

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