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Proceedings Paper

Three-dimensional micro-nano-hierarchical porous structures based on the deposition of the ablated material by picosecond pulses
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Paper Abstract

This study was performed using picosecond pulses to obtain the three-dimensional micro-nano-hierarchical porous structures on the surface of titanium via the combination of the ablation and the deposition of ablated particles. For the repetition rate of 100 kHz and the scanning speed of 10 mm/s, there were secondary nano-tree-like micro-nano structures via the deposition of the ablated material formed on the primary microstructures. However, when the scan speed decreased, the primary microstructures were invisible owing to too much material deposition. When the repetition rate increased to 500 kHz, the ablated particles were irradiated by the posterior pulse before deposition onto the surface of material, and agglomerated into spidernet-like nanostructures. Then, the upper layer of the secondary micro-nano structure was molten and came into micro-nano porous fractal structures. Both the secondary micro-nano porous structures showed the hierarchy in the vertical and horizontal direction of the surface of titanium. Contact angle measurement after 3 months indicated that the nano-tree-like micro-nano structures showed super-hydrophilcity, and the spidernet-like nano and micro-nano porous fractal structures showed super-hydrophobicity.

Paper Details

Date Published: 19 February 2018
PDF: 7 pages
Proc. SPIE 10520, Laser-based Micro- and Nanoprocessing XII, 105201N (19 February 2018);
Show Author Affiliations
Aifei Pan, Xi'an Jiaotong Univ. (China)
Shaanxi Key Lab. of Intelligent Robots (China)
Wenjun Wang, Xi'an Jiaotong Univ. (China)
Shaanxi Key Lab. of Intelligent Robots (China)
Xuesong Mei, Xi'an Jiaotong Univ. (China)
Shaanxi Key Lab. of Intelligent Robots (China)
Gedong Jiang, Xi'an Jiaotong Univ. (China)
Shaanxi Key Lab. of Intelligent Robots (China)

Published in SPIE Proceedings Vol. 10520:
Laser-based Micro- and Nanoprocessing XII
Udo Klotzbach; Kunihiko Washio; Rainer Kling, Editor(s)

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