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Proceedings Paper

Opto-electronic packaging of fiber-coupled systems (Conference Presentation)
Author(s): Sven Mahnkopf; Tom Haslett; Apurva Jain

Paper Abstract

Challenges and resolution approaches of fiber coupling to and from optical devices will be discussed. Particular emphasis will be paid to hermetic and ruggedized assemblies.

Paper Details

Date Published: 14 March 2018
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Proc. SPIE 10513, Components and Packaging for Laser Systems IV, 105130A (14 March 2018); doi: 10.1117/12.2287956
Show Author Affiliations
Sven Mahnkopf, Avo Photonics, Inc. (United States)
Tom Haslett, Avo Photonics, Inc. (United States)
Apurva Jain, Avo Photonics, Inc. (United States)


Published in SPIE Proceedings Vol. 10513:
Components and Packaging for Laser Systems IV
Alexei L. Glebov; Paul O. Leisher, Editor(s)

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