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Proceedings Paper

Super-resolution critical dimension limits of positive tone i-line photoresists
Author(s): David B. Miller; Adam M. Jones; Robert R. McLeod
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Paper Abstract

Applying a technique borrowed from super-resolution microscopy to photolithography, we achieve critical dimensions well below the diffraction limit. Exposing photoresist in the far-field, over a broad area, we can demonstrate dimensions as small as λ/7. In this paper, we show that conventional i-line photoresists exposed with this technique, along with modified processing, are capable of supporting features as small as 50 nm, and possibly smaller. We consider the necessary requirements to achieve sub-diffraction dimensions, detail a simple model for photoresist development, and show its use in predicting the minimum attainable feature size. Finally, we characterize two commercial photoresists, and compare the resulting features to those of the model.

Paper Details

Date Published: 22 February 2018
PDF: 10 pages
Proc. SPIE 10544, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XI, 105440N (22 February 2018); doi: 10.1117/12.2287470
Show Author Affiliations
David B. Miller, Univ. of Colorado Boulder (United States)
Adam M. Jones, Sandia National Labs. (United States)
Robert R. McLeod, Univ. of Colorado Boulder (United States)


Published in SPIE Proceedings Vol. 10544:
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XI
Georg von Freymann; Winston V. Schoenfeld; Raymond C. Rumpf, Editor(s)

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