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Proceedings Paper

Subsurface damage distribution and processing method of ground fused silica
Author(s): Heng Zhao; Chao Cai; Wang Gang; Xiang He; Qing Hu; Ping Ma
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Paper Abstract

Subsurface damage (SSD) has been identified as a main initiator of laser-induced damage in fused silica, and the most of SSD is produced during grinding process. The distribution and morphology of SSD in fused silica samples ground with loose abrasive are investigated by magneto-rheological finishing (MRF) dimpling and buffered oxide etch (BOE) etching method. The results demonstrate that the SSD depth is most responsive to the loose abrasive size and the BOE etching is good for removing the SSD. Based on these results, an efficient grinding technique combined with BOE etching is proposed to reduce the SSD of fused silica, and the damage threshold is obviously improved by this routine as a result.

Paper Details

Date Published: 24 October 2017
PDF: 7 pages
Proc. SPIE 10457, AOPC 2017: Laser Components, Systems, and Applications, 1045724 (24 October 2017); doi: 10.1117/12.2284768
Show Author Affiliations
Heng Zhao, Chengdu Fine Optical Engineering Research Ctr. (China)
Chao Cai, Chengdu Fine Optical Engineering Research Ctr. (China)
Wang Gang, Chengdu Fine Optical Engineering Research Ctr. (China)
Xiang He, Chengdu Fine Optical Engineering Research Ctr. (China)
Qing Hu, Chengdu Fine Optical Engineering Research Ctr. (China)
Ping Ma, Chengdu Fine Optical Engineering Research Ctr. (China)


Published in SPIE Proceedings Vol. 10457:
AOPC 2017: Laser Components, Systems, and Applications
Shibin Jiang; Lijun Wang; Lan Jiang; Long Zhang, Editor(s)

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